| 摘要 |
PURPOSE: A tape loader in semiconductor equipment is provided to control a badness generation of TCP(Tape Carrier Package) by damage of lead and to improve the yield of TCP(Tape Carrier Package) production by preventing the lead tape from being tangled to each other although there is a difference between a release speed coming untied lead tape from tape reel and a feeding speed of the lead tape at a bonding apparatus and reducing the loss of time taking a trouble step for the tangle of lead tape. CONSTITUTION: A lead tape(15) is wound on a tape reel(10,20). A guide wheel(12) is formed under the tape reel(10,20) and converts a feeding direction of the lead tape(15) so that the lead tape(15) is released from the tape reel(10,20) to be fed. A guide side(100) is formed between the tape reel(10,20) and the guide wheel(12) and has an incline plane roundly so that the released lead tape(15) slides and feeds on the guide wheel(12).
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