SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a method for manufacturing the same are provided to stack an MLF(Micro Lead Frame) type semiconductor package on a semiconductor package by exposing input and output portions formed on an upper and a lower portion of a body of the semiconductor package. CONSTITUTION: A multitude of input/output pad(2a) is formed on a semiconductor chip(2). A chip loading plate(7) is adhered to a lower portion of the semiconductor chip(2) by using an adhesive. The first to the third lead(6a,6b,6c) are formed on an outer circumference of the chip loading plate(7). The input/output pad(2a) is connected electrically with the first lead(6a) by a conductive wire(8). The semiconductor chip(2), the conductive wire(8), the chip loading plate(7), and the inner leads are encapsulated by an encapsulant. A body(10) is formed by exposing the chip loading plate(7), a bottom face of the first lead(2a), and an upper face of the third lead in the encapsulating process.