| 摘要 |
PURPOSE: A target magnet assembly for processing semiconductor sputtering is provided to reduce a cost burden due to expensive materials and to increase a production of a wafer by prolonging its life time, reducing wasting volume of target. CONSTITUTION: The axis of rotation(20) is coupled to the center of a backside block(10). Plural target magnets(32,34) are connected to one side of the axis of rotation(20) in the axis direction with a predetermined intervals so as to magnify an implantation distribution area of the target. A plurality of equilibrium weights(42,44) are connected to the target magnet(32,34) facing opposed to other side of the axis of rotation(20).
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