发明名称 |
Flip chip chip-scale package |
摘要 |
A semiconductor flip chip chip-scale package that includes a metal heat slug bonded to the surface of a semiconductor chip. The heat slug protects the chip from being damaged as well as assists heat dissipation. Openings may also be formed on the heat slug to provide better air flow for cooling. A first packaging process for the chip-scale packages bonds a single heat slug to each semiconductor chip on a substrate panel. A second packaging process bonds a long heat slug comprising a plurality of connected heat slugs to the semiconductor substrate panel at the same time. Conventional packaging equipment can be used for both packaging processes to manufacture the chip-scale packages.
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申请公布号 |
US6255140(B1) |
申请公布日期 |
2001.07.03 |
申请号 |
US19990413047 |
申请日期 |
1999.10.06 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
WANG HSING-SENG |
分类号 |
H01L21/56;H01L21/60;H01L21/68;H01L23/00;H01L23/36;H01L23/498;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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