| 摘要 |
PROBLEM TO BE SOLVED: To provide a tin/copper alloy plating bath capable of depositing bright plating film in a current density region in a wide range. SOLUTION: This tin/copper alloy electroplating bath free from cyanide compounds is composed of an aqueous solution for electroplating of tin/tinalloys and is obtained by adding organic sulfonic acid as acid, the bivalent tin salt and bivalent copper salt of organic sulfonic acid as metallic salt and, moreover, a dispersant and a brightener.
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