发明名称 Low-melting copolyester and copolyetherester hot-melt adhesives
摘要 Novel, quick-crystallizing hot-melt adhesive masses having a melting point between 60 and 100 C. comprise a statistically-proportioned copolyester or copolyetherester based on terephthalic acid, adipic acid and a mixture of aliphatic diols; the molar proportion of terephthalic acid is between 55 and 85 mole %, relative to the total acid quantity; and the molar proportion of adipic acid is between 15 and 40 mole %. A combination of butane diol and hexane diol is used as the diol component; the molar component of butane diol is between 40 and 55 mole %; and the molar proportion of hexane diol is between 40 and 60 mole %. Up to 15 mole % of a dimer acid having a molar mass between 400 and 800 g/mole, or up to 10 mole % of a higher-molecular polyethylene glycol having a molecular mass of 600 to 4000 g/mole, can be used to increase the flexibility. The copolyester or copolyetherester hot-melt adhesive masses of the invention can be used in the hot-melt method, and in powder-form coating methods
申请公布号 US6255443(B1) 申请公布日期 2001.07.03
申请号 US19990352998 申请日期 1999.07.13
申请人 EMS CHEMIE AG 发明人 KINKELIN EBERHARD;SPINDLER JüRGEN;POESSENECKER GERHARD
分类号 B32B7/12;C08G63/16;C09J5/06;C09J167/02;(IPC1-7):C08G63/02;C08G63/18;C08G63/181;C08G63/183 主分类号 B32B7/12
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