发明名称 |
Method of creating optimal photoresist structures used in the manufacture of metal T-gates for high-speed semiconductor devices |
摘要 |
A process for forming T-shaped metal contacts on a dielectric substrate. The process includes deposition of first and second photoresist layers onto a substrate; individually overall electron beam exposure of both layers; with subsequent imagewise UV exposure and development of both layers to form hollow cavities in the layers. By concentrating the electron beam radiation on the mid-point in the thickness of each photoresist layer, the radiation is distributed throughout each layer, resulting in solubility properties which lead to the formation of hollow cavities of a certain desired shape. In one embodiment of the invention, three-dimensional structures are formed in the photoresist layers by filling the hollow cavities with metal. Subsequent removal of unwanted portions of the photoresist layers produces a dielectric substrate having T-shaped metal contacts on its surface.
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申请公布号 |
US6255035(B1) |
申请公布日期 |
2001.07.03 |
申请号 |
US19990270535 |
申请日期 |
1999.03.17 |
申请人 |
ELECTRON VISION CORPORATION |
发明人 |
MINTER JASON P.;LEE JOHN R. |
分类号 |
G03F7/095;G03F7/20;H01L21/285;(IPC1-7):G03C5/00;H01L21/28 |
主分类号 |
G03F7/095 |
代理机构 |
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