发明名称 SURFACE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment apparatus which can be applied to a member to be surface-treated which is light in weight and not necessarily high in strength like a bond magnet, and achieve the uniform plating free from any contact trace. SOLUTION: The surface treatment apparatus to achieve the surface treatment on the member to be surface-treated having an inner circumferential surface of a cylindrical shape or the like comprises a supporting member to support the member to be surface-treated and gives the rotation thereto, and a load applying member to press the member to be surface-treated against the supporting member.
申请公布号 JP2001181893(A) 申请公布日期 2001.07.03
申请号 JP20000313524 申请日期 2000.10.13
申请人 SUMITOMO SPECIAL METALS CO LTD 发明人 YOSHIMURA MASAYUKI;NISHIUCHI TAKESHI;KIKUI FUMIAKI
分类号 C25D7/00;C25D7/04;C25D17/08;C25D21/10;(IPC1-7):C25D7/00 主分类号 C25D7/00
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