| 摘要 |
PROBLEM TO BE SOLVED: To provide a microetching agent capable of executing microetching free from the generation of unevenness in etching even in the case microstains such as oily components are present on the surface of copper. SOLUTION: This microetching agent for copper and/or copper alloys is composed of an aqueous solution containing (a) ferric sulfate (III), (b) sulfuric acid and (c) nonionic surfactant, the concentration of (a) is 1 to 40 wt.%, the ratio of (b) to 100 pts.wt. of (a) is 5 to 50 pts.wt., the concentration of (c) is 0.01 to 10 wt.%, the content of halogen is 0.01 to 20 wt.%, and suitably, (d) phosphoric acid of 0.01 to 30 wt.%, or (e) carboxylic acid of 0.01 to 30 wt.%, or (d) phosphoric acid of 0.01 to 15 wt.% and (e) carboxylic acid of 0.01 to 15 wt.% are contained.
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