发明名称 |
Resin-having metal foil for multilayered wiring board, process for producing the same, multilayered wiring board, and electronic device |
摘要 |
The invention provides resin-having metal foil for a multilayered wiring board which comprises metal foil having provided on one side thereof a film of a thermosetting resin having a relative dielectric constant of not higher than 3.3 at a frequency range of not lower than 1 MHz and having a resin flow of from 1 to 50% or from 5 to 50%, and a process for producing the same. The invention also provides a (sequentially) multilayered wiring board produced by using the resin-having metal foil and an electronic device comprising the multilayered wiring board and an electronic element connected thereto with a wiring means.
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申请公布号 |
US6254971(B1) |
申请公布日期 |
2001.07.03 |
申请号 |
US19990202078 |
申请日期 |
1999.04.23 |
申请人 |
ASAHI KASEI KABUSHIKI KAISHA |
发明人 |
KATAYOSE TERUO;KINOSHITA SHOZO;ARAI TAKESHI |
分类号 |
H01L23/14;H05K1/00;H05K1/02;H05K1/03;H05K3/46;(IPC1-7):B32B3/00 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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