发明名称 |
Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamination |
摘要 |
The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away from its mid-plane. Another embodiment of the present invention describes a method and apparatus of arranging the layers of a laminate for use in PBGA packaging that arranges the layers of the laminate according to the stiffness of each layer. Another embodiment of the present invention describes a method and apparatus of packaging a flip chip that uses one or more redundant interconnections at the bottom of the package substrate where the redundant interconnections are within the shadow of the IC chip.
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申请公布号 |
US6255599(B1) |
申请公布日期 |
2001.07.03 |
申请号 |
US19970912451 |
申请日期 |
1997.08.18 |
申请人 |
IBM |
发明人 |
CHANG CHI SHIH;CHEN WILLIAM T.;TRIVEDI AJIT |
分类号 |
H01L21/56;H01L23/498;H05K1/02;H05K1/11;H05K3/42;H05K3/46;(IPC1-7):H05K1/03 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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