发明名称 METHOD OF THIN FILM DEPOSITION
摘要 PROBLEM TO BE SOLVED: To perform thin film deposition with superior reproducibility by stably producing gas plasma in manufacturing a thin film by plasma enhanced CVD. SOLUTION: A reactant gas containing a source gas for thin film, such as silane halide gas, is supplied into a reaction chamber held in a vacuum state, and plasma excitation electric power is applied by time modulation outgoing to a plasma generation electrode disposed in the chamber or to a plasma generation electrode disposed outside the chamber via a dielectric to generate reactant gas plasma, by which a thin film, such as silicon thin film, is deposited on the surface of a substrate disposed in the chamber.
申请公布号 JP2001181847(A) 申请公布日期 2001.07.03
申请号 JP19990362227 申请日期 1999.12.21
申请人 TOKUYAMA CORP 发明人 AZUMA MASANOBU;TOFUTEII JURAITEII
分类号 H01L21/205;C23C16/50;(IPC1-7):C23C16/50 主分类号 H01L21/205
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