发明名称 BOARD AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a new board by using an adhesive not containing formaldehyde and quickly setting under room temperature. SOLUTION: This board is manufactured by bonding small particulate materials together through a two-part adhesive. For this board, the adhesive consists of a liquid A which is an aqueous solution or a water-based dispersion including a polymer compound having an amide bond or an imide group in a molecule, and a liquid B which is an aqueous solution including a water-soluble dialdehyde.
申请公布号 JP2001179713(A) 申请公布日期 2001.07.03
申请号 JP19990367834 申请日期 1999.12.24
申请人 YAMADA YASUHIRO;OSHIMA YUKIO 发明人 YAMADA YASUHIRO
分类号 B27N3/02;B27N1/02;(IPC1-7):B27N3/02 主分类号 B27N3/02
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