发明名称 |
BOARD AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a new board by using an adhesive not containing formaldehyde and quickly setting under room temperature. SOLUTION: This board is manufactured by bonding small particulate materials together through a two-part adhesive. For this board, the adhesive consists of a liquid A which is an aqueous solution or a water-based dispersion including a polymer compound having an amide bond or an imide group in a molecule, and a liquid B which is an aqueous solution including a water-soluble dialdehyde.
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申请公布号 |
JP2001179713(A) |
申请公布日期 |
2001.07.03 |
申请号 |
JP19990367834 |
申请日期 |
1999.12.24 |
申请人 |
YAMADA YASUHIRO;OSHIMA YUKIO |
发明人 |
YAMADA YASUHIRO |
分类号 |
B27N3/02;B27N1/02;(IPC1-7):B27N3/02 |
主分类号 |
B27N3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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