| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method and a plating apparatus in which an arbitrarily different plating condition can be made for face and reverse sides of a plate-like work including a printed circuit board, the film thickness ratio can be set to an arbitrary value, and the finish is uniform. SOLUTION: A pair of anodes (not shown in the figure) are disposed at locations facing each other in a plating tank 1, and works 3 and 3 fixed to a hanger jig 2 are disposed therebetween. Work fixing units 16 and 16 to demarcate the plating tank 1 into a face side plating tank 1a and a reverse side plating tank 1b with the plate-like work 3 as a bulkhead are disposed on an inner wall of the plating tank 1, individually controllable current control devices to supply the current for plating are arranged between the face side anode and a hanger jig 2, and between a reverse side anode and the hanger jig 2 to individually control the plating condition in the face side plating tank 1a and the reverse side plating tank 1b.
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