发明名称 |
VACUUM FILM DEPOSITION SYSTEM |
摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum film deposition system capable of depositing a film having highly precise film thickness distribution and excellent in reproducibility. SOLUTION: The system is provided with: a base plate 10 having strength where the deformation due to difference between internal and external air pressures at evacuation becomes negligible; a chamber 11 disposed on the base plate via a sealing member 12 and constituting a vacuum chamber; a substrate holder 16 attached to the base plate 10 via a connecting member and holding a substrate 17 disposed within the vacuum chamber in a manner not to be mechanically constrained to the chamber; and film deposition sources 18 and 23 disposed within the vacuum chamber in a manner to be opposed to the substrate 17 and held parallel to the substrate 17 and attached to the base plate 10 via a sealing member 19.
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申请公布号 |
JP2001181821(A) |
申请公布日期 |
2001.07.03 |
申请号 |
JP19990360297 |
申请日期 |
1999.12.20 |
申请人 |
MURATA MFG CO LTD |
发明人 |
TANABE HIDEO;HAYASHI SHIGEO;KARASAWA YASUHIKO |
分类号 |
C23C14/00;C23C14/34;G06F13/00;(IPC1-7):C23C14/00 |
主分类号 |
C23C14/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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