发明名称 VACUUM FILM DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a vacuum film deposition system capable of depositing a film having highly precise film thickness distribution and excellent in reproducibility. SOLUTION: The system is provided with: a base plate 10 having strength where the deformation due to difference between internal and external air pressures at evacuation becomes negligible; a chamber 11 disposed on the base plate via a sealing member 12 and constituting a vacuum chamber; a substrate holder 16 attached to the base plate 10 via a connecting member and holding a substrate 17 disposed within the vacuum chamber in a manner not to be mechanically constrained to the chamber; and film deposition sources 18 and 23 disposed within the vacuum chamber in a manner to be opposed to the substrate 17 and held parallel to the substrate 17 and attached to the base plate 10 via a sealing member 19.
申请公布号 JP2001181821(A) 申请公布日期 2001.07.03
申请号 JP19990360297 申请日期 1999.12.20
申请人 MURATA MFG CO LTD 发明人 TANABE HIDEO;HAYASHI SHIGEO;KARASAWA YASUHIKO
分类号 C23C14/00;C23C14/34;G06F13/00;(IPC1-7):C23C14/00 主分类号 C23C14/00
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