| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a package which prevents an electric short-circuit from being generated between adjacent external lead terminals when the external lead terminals are deformed. SOLUTION: In a package for housing a semiconductor chip, one end of every external lead terminal 7 is fixed to a container 4 whose inside comprises a space used to house the semiconductor chip, and the other end of every external lead terminal 7 is made to protrude to the outside from the side face of the container 4 so as to be attached to, and mounted on, an electric insulating connection member 8. Then, a plurality of metal layers 9 to and on which the other end of every external lead terminal 7 is attached and mounted and whose width is substantially identical to the width of every external lead terminal 7 are formed additionally on the surface of the coupling member 8 by keeping a prescribed interval, and protrusions 9a are formed alternately on respective sides of the respective adjacent metal layers 9.</p> |
