Method for nondestructively measuring the stress of fabricated semiconductor chips

摘要

A method for nondestructively and accurately determining the stress of a fabricated semiconductor chip soldered, brazed or otherwise bonded to a submount using optical microscopy and finite element analysis. Deformations on a top surface of the semiconductor chip are first examined using optical microscopy. The deformations are then correlated using finite element analysis to the stress on the semiconductor chip caused by the soldering process. If the stress is determined to be within an acceptable range of measurement, then the semiconductor chip will have been properly soldered to the submount and can be used.