| 发明名称 |
Method and apparatus for encoding information in an ic package |
| 摘要 |
An integrated circuit (IC) package includes a substrate, a ground line, and an encoded region. The encoded region provides information based upon selective deposition of solder balls electrically coupled to the ground line. |
| 申请公布号 |
AU1233801(A) |
申请公布日期 |
2001.07.03 |
| 申请号 |
AU20010012338 |
申请日期 |
2000.10.25 |
| 申请人 |
INTEL CORPORATION |
发明人 |
JOHN W. HORIGAN;LARRY L. MORESCO |
| 分类号 |
H01L23/544;H05K1/02;H05K3/34 |
主分类号 |
H01L23/544 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
