POLYIMIDE BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a polyimide board having heat resistance, comprising strongly bonded layers, having surface smoothness and generating no warpage. SOLUTION: A polyimide board is constituted by bonding a plurality of heat-resistant polyimide films by a heat-resistant adhesive containing polyimidosiloxane as an essential component and has a thickness of 0.15-3 mm and an interlaminar adhesion strength of 1.0 kg/am width or more.