摘要 |
PROBLEM TO BE SOLVED: To provide a device for simulating gas-assist molding which can simulate a hollow space ratio exactly at the position of gas progress. SOLUTION: A data base 3 including a gas pressure/molten resin temperature data base indicating the correspondence relationship between the pressure of gas to be supplied into a molten resin and a molten resin temperature area which can make the inside of the molten resin hollow by the gas pressure and a gas pressure/gas progress speed data base indicating the correspondence relationship between a gas pressure and a gas progress speed is formed. A gas hollow part simulation part 6 determines a gas progress starting time and a gas progress speed in the molten resin on the basis of the results of simulation of a process from packing to cooling and simulation conditions (the data base 3, molding conditions, and gas conditions), calculates the size of a hollow area at the position of gas progress, and obtains a hollow shape.
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