| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic cleaning process which enables removal of dust and particles from a board provided with wiring, etc., without causing any damage to the wiring, in ultrasonic cleaning using high frequency ultrasonic waves, and also to provide a device for the process. SOLUTION: This cleaning process using this device comprises performing ultrasonic cleaning in a medium consisting of a dispersion medium and a liquid or viscoelastic material which, in the form of finely divided particles, is dispersed in the dispersion medium.
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