发明名称 PLATING MATERIAL FOR CONNECTOR
摘要 PROBLEM TO BE SOLVED: To reduce the cracking of a plating film generated at the time of subjecting a plating material to bending into a contact and to moreover reduce the inserting force of a connector using a tin plating material. SOLUTION: This plating material for a connector excellent in bendability and insertability and drawability is composed, to a base metal of copper or a copper alloy, of an intermediate layer of alloy plating with a thickness of 0.3 to 1.0μm containing, by mass, 2 to 10% phosphorus, and the balance nickel with inevitable impurities and a surface layer of Sn or Sn alloy plating subjected to reflowing treatment, and the intermediate layer has been plated under the condition in which cathode current density is 2 to 20 A/dm2.
申请公布号 JP2001181888(A) 申请公布日期 2001.07.03
申请号 JP19990359047 申请日期 1999.12.17
申请人 NIPPON MINING & METALS CO LTD 发明人 KODAMA ATSUSHI;FUKAMACHI KAZUHIKO
分类号 C25D3/56;C25D7/00;(IPC1-7):C25D3/56 主分类号 C25D3/56
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