| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a resin composition capable of providing a heat-resistant plastic card having extremely improved adhesion to a base material when the base material for the plastic card is laminated, and adhesion to a thermoplastic resin protecting layer when the protection layer of the thermoplastic resin is formed at least on one surface layer of the plastic card, when the composition is used as the plastic card, and, capable of reducing the decrease of the height of a convex part of data stamped by an embossing finish even if the plastic card is left under a comparatively high temperature condition in daily life, and capable of reducing the warp of the plastic card itself accompanied by the embossing finish. SOLUTION: This resin composition for the heat-resistant plastic card is characterized by (C) 0.5-15 pts.wt. thermoplastic copolyester composed of terephthalic acid, isophthalic acid ethylene glycol and bisphenol-A compounded with 100 pts.wt mixture of (A) 70-25 wt.% polycarbonate resin and (B) 30-75 pts.wt. isophthalic acid-modified polybutylene terephthalate.</p> |
