发明名称 |
Active shield for generating a plasma for sputtering |
摘要 |
A combination coil and shield for a plasma chamber in a semiconductor fabrication system is provided. The coil-shield has a plurality of turns to couple energy efficiently into a plasma and also substantially blocks deposition material from reaching a second shield positioned behind the first shield.
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申请公布号 |
US6254737(B1) |
申请公布日期 |
2001.07.03 |
申请号 |
US19960730722 |
申请日期 |
1996.10.08 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
EDELSTEIN SERGIO;SUBRAMANI MANI |
分类号 |
C23C14/00;C23C14/34;H01J37/32;H01J37/34;H01L21/02;H01L21/203;H01L21/285;(IPC1-7):C23C14/34 |
主分类号 |
C23C14/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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