DEVICE FOR TAKING SEMICONDUCTOR WAFER OUT OF RUNNER DISK OF DOUBLE SURFACE POLISHING MACHINE

摘要

PROBLEM TO BE SOLVED: To improve the working accuracy while stabilizing the transference in the case of cutting and grinding an end surface by transferring a device main body along an end surface of a work such as a steel pipe and a plate material, or transferring the work. SOLUTION: This device is formed of a transferring drum to be rotated by a rotary driving motor, at least two pushing bodies energized by springs in the transferring drum direction, and a tool for working an end surface of a work. A rolling belt is stretched between both the pushing bodies.