POLISHING PAD, AND POLISHING DEVICE AND POLISHING METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad capable of retaining suitable polishing characteristic only in a simple bristle brushing operation. SOLUTION: The polishing pad comprises the variation of a value for an average roughness Ra of a center line of one silicon wafer with an oxide film being 0.2 μm or less after polishing with an uneven surface profile dressed before polishing, as a reference.