| 摘要 |
PURPOSE: A rapid thermal annealing apparatus is provided to uniformly apply heat to a wafer and thereby to improve reliability of annealing. CONSTITUTION: The apparatus includes a tube(20) capable of holding a wafer, a chamber(10) almost enclosing the tube(20), linear lamps(33) disposed at front and rear outer sides of the tube(20) inside the chamber(10), and circular lamps(50) placed on and under the tube(20) inside the chamber(10). The tube(20) has a gas injection line(21) and an entrance for the wafer. When a gas such as nitrogen is supplied into the tube(20) through the gas injection line(21) and also the wafer mounted on a tray is inserted into the tube(20) through the entrance, the linear lamps(33) and the circular lamps(50) are turned on to heat the wafer. In particular, since each circular lamp(50) is shaped like a concentric circle, and further, since the respective circular lamps(50) apply heat to upper and lower surfaces of the wafer, the wafer can be uniformly heated.
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