| 摘要 |
PURPOSE: A multi-chip package is provided to reduce the number of wire by shortening a distance between a bonding pad and a lead. CONSTITUTION: The second semiconductor chip(130) is laminated on an upper portion of the first semiconductor chip(110). The first semiconductor chip(110) is connected electrically to the second semiconductor chip(130). A multitude of conductive lead(210) is printed on a tape(200). The tape(200) is connected electrically to the first and the second semiconductor chips(110,130). A solder bump(230) connects electrically the first semiconductor chip(110) with the leads(210). A wire(235) connects electrically the second semiconductor chip(130) with the leads(210). A molding portion(150) covers a predetermined portion of the tape(200) and the first and the second semiconductor chips(110,130).
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