WAFER HANDLING UNIT

摘要

PURPOSE: A wafer handling unit is provided to prevent a scratch phenomenon by performing a stable handling process for a wafer. CONSTITUTION: A multitude of loading groove(11a) for receiving a multitude of wafer is formed at both sides of the cassette body(11). A cover portion(40) is formed at each loading groove(11a) of an upper part of the cassette body(11). The cover portion(40) and the guide portion(42) are formed with one body. A cover body(41) and an auxiliary loading groove(42a) are formed at the guide portion(42). The cover body(41) is combined selectively around the cassette body(11). The auxiliary loading groove(42a) is combined with both sides of the cover body(41).