发明名称 THERMOPLASTIC POLYAMIDE
摘要 PURPOSE: Provided is a thermoplastic polyamide for lamination, adhesion, filler, etc., which is excellent in bond force and dose not generate pollution and dose not be deformed largely. CONSTITUTION: The thermoplastic polyamide is produced copolymerizing 5-40wt% of C6-C12 linear aliphatic dicarboxylate, 10-40wt% of C2-C6 aliphatic diamine or a mixture of C2-C6 aliphatic diamine and polyalkylene glycol diamine having a molecular weight of less than 4000, and 30-85wt% of caprolactam. The copolymerized polyamide is swelled by hot water of more than 80&deg;C or steam and has a swelling property of 1.7=<Vs/Vo x 1.12 and a melting point of Tm>Ts+50deg.C, wherein Vs is a volume of the polyamide swelled in the hot water of more than 80deg.C, Vo is a volume of the polyamide at an ordinary temperature, Tm is a melting point of the polyamide, and Ts is a swelling temperature of the polyamide in the hot water.
申请公布号 KR20010054759(A) 申请公布日期 2001.07.02
申请号 KR19990055715 申请日期 1999.12.08
申请人 KOLON IND. INC./KR 发明人 KIM, JAE YEONG;LIM, YEONG
分类号 C08G73/14 主分类号 C08G73/14
代理机构 代理人
主权项
地址