| 摘要 |
PURPOSE: An IC(Integrated Circuit) socket for BGA(Ball Grid Array) is provided to form a holder of the IC socket in a mold, and to form slopes in both elastic hinges formed in both lower parts of the holder to form circular inserting grooves, so as to easily couple a spring in the IC holder coupled with a slide. CONSTITUTION: An IC(Integrated Circuit) guide positions a semiconductor IC in a predetermined position. A slide(40) mounts the semiconductor IC by the guide. An IC holer(90), where elastic hinges(62) are formed in lower parts, fixes an upper part of the slide(40). A hooking protuberance(94) is for inserting a spring(30) in a lower part of the IC holder(90). Slopes(96) having predetermined angles in the external of the hinges(62) are formed in the elastic hinges(62), to be easily coupled with hooking projections(42) formed in upper parts of the slide(40). And circular inserting grooves(92) are formed around the outer circumference of the lower part of the hooking protuberance(94), to enable an upper part of the spring(30) to be easily inserted in the hooking protuberance(94).
|
