发明名称 |
EMBOSSING SPACER OF FLEXIBLE SUBSTRATE |
摘要 |
PURPOSE: An embossing spacer of a flexible substrate is provided to prevent an adhering phenomenon between a flexible substrate and an embossing spacer by applying a release agent on the embossing spacer. CONSTITUTION: An adhesive polymer(140) is applied on a flexible substrate(120) on which a semiconductor chip(110) is mounted. The flexible substrate(120) is wound on a reel. An embossing spacer(170) is formed on an upper portion of the flexible substrate(120). A unevenness portion(160) is formed on the embossing spacer(170). The embossing spacer(170) is wound on the reel(150). A release agent(180) is applied on the embossing spacer(170).
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申请公布号 |
KR20010054786(A) |
申请公布日期 |
2001.07.02 |
申请号 |
KR19990055757 |
申请日期 |
1999.12.08 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, JIN GWAN |
分类号 |
H01L21/60;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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