发明名称 EMBOSSING SPACER OF FLEXIBLE SUBSTRATE
摘要 PURPOSE: An embossing spacer of a flexible substrate is provided to prevent an adhering phenomenon between a flexible substrate and an embossing spacer by applying a release agent on the embossing spacer. CONSTITUTION: An adhesive polymer(140) is applied on a flexible substrate(120) on which a semiconductor chip(110) is mounted. The flexible substrate(120) is wound on a reel. An embossing spacer(170) is formed on an upper portion of the flexible substrate(120). A unevenness portion(160) is formed on the embossing spacer(170). The embossing spacer(170) is wound on the reel(150). A release agent(180) is applied on the embossing spacer(170).
申请公布号 KR20010054786(A) 申请公布日期 2001.07.02
申请号 KR19990055757 申请日期 1999.12.08
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, JIN GWAN
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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