| 摘要 |
PURPOSE: A chip size package is provided to enable an efficient dissipation of heat generated from a semiconductor chip in operation of the package. CONSTITUTION: The package includes an insulating substrate(11) in which a stepped part(11a) and a cavity(11b) are centrally formed, the semiconductor chip(12) located in the cavity(11b), signal lines(13) formed in the substrate(11) and also extended onto the stepped part(11a), metal wires(15) electrically connecting chip pads formed on the chip(12) to bond fingers(14) formed on inner ends of the signal lines(13), and outer leads(16) connected to outer ends of the signal lines(13) and also arranged on outer sides of the substrate(11). Moreover, the package further includes a heat sink(20) closely attached to a lower surface of the chip(12) to efficiently dissipate heat generated from the chip(12). The heat sink(20) has an inserting bar(20a), which is inserted into a through hole(11c) formed in the substrate(11) and then fixed at an upper end thereof by solder(21). |
