发明名称 METHOD FOR BURYING GAP BY HIGH DENSITY PLASMA OXIDE LAYER AND DEPOSITION UNIT USED FOR THE SAME
摘要 PURPOSE: A method for burying a gap by a high density plasma oxide layer and a deposition unit used for the same are provided to bury a gap without a void by etching the first high density plasma oxide layer to reduce an aspect ratio of a gap and depositing the second high density plasma oxide layer thereon. CONSTITUTION: The first high density plasma oxide layer is deposited on an upper portion of a substrate(100) including a gap. The first high density plasma oxide layer is etched partially by using fluorine ions. The second high density plasma oxide layer(106) is deposited on an upper portion of the whole structure. The gap is buried by the second high density plasma oxide layer(106).
申请公布号 KR20010054073(A) 申请公布日期 2001.07.02
申请号 KR19990054706 申请日期 1999.12.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, SEON RAE;LEE, SU GEUN;PARK, SEON HU
分类号 H01L21/316;H01L21/311;H01L21/768;(IPC1-7):H01L21/316 主分类号 H01L21/316
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