| 摘要 |
PURPOSE: A semiconductor package is provided to permit an increase in memory density with a simplified manufacturing process and a reduced manufacturing cost. CONSTITUTION: The package includes upper and lower bare chips(10,20) each of which has a plurality of chip pads, and a conductive film(30) which is interposed between the upper and lower chips(10,20). The upper and lower chips(10,20) are mounted on the conductive film(30) to confront each other. The conductive film(30) has a plurality of connection pads formed along periphery thereof and signal lines formed between the connection pads to electrically couple the upper and lower chips(10,20). The package further includes a molded body(40) encapsulating the conductive film(30) and the upper and lower chips(10,20), and outer leads(50) connected to the respective connection pads on the conductive film(30).
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