LEAD FRAME FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A lead frame for manufacturing a semiconductor package is provided to perform smoothly a molding process by forming sufficiently a space for floating a molding compound. CONSTITUTION: A multitude of outer lead(160) is extended to an inside of a frame body(100). A multitude of inner lead(130) is extended to an inside of the outer leads(160). A lead lock tape(140) is adhered along an inner circumference of inside of the inner lead(130) in order to fix a position of the inner lead(130). A die pad(120) is located at a center portion of the inner lead(130). A semiconductor chip is loaded on an upper portion of the inner lead(130). A tie bar(110) is adhered to the lead lock tape(140) and connected with the die pad(120).