SEMICONDUCTOR PACKAGE INCLUDING DOUBLE UNDERFILL AREA

摘要

PURPOSE: A semiconductor package including double underfill area is provided to prevent a fillet part of underfill area from cracking. CONSTITUTION: A bonding pad(112) is formed on a semiconductor chip(110). The bonding pad(112) is connected with the semiconductor chip(110) through a bump(120). The semiconductor chip(110) is composed of a substrate(130), an external connection terminal(140) such as solder balls, and a double underfill area(150). The double underfill area(150) consists of the first underfill area(154) and the second underfill area(156). The first underfill area(154) locates between the semiconductor chip(110) and the substrate(130), and is filled with liquid type of a sort of epoxy material. The second underfill area(156) positions around the semiconductor chips(110), and it is reclaimed with a sort of silicon material.