| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method of recessed holes which is stable in forming a uniform plating layer even for small holes and suitable for forming via holes in a multi-layer circuit substrate. SOLUTION: In forming a plating layer using a plating solution on an inner wall of a recessed hole 3A which is formed in a surface of a work A1 to be plated, 50-100μm in diameter, and 0.8-3.0 in the ratio of the hole diameter to the depth, the recessed hole is plated while continuously or intermittently blowing a jet 12a of the plating solution toward the recessed hole 3A from a jet nozzle 15.
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