Aircraft/tank modular electronic cooling unit having printed circuit board with protection cover having surface near component having thermal conductivity above cover.

摘要

The electronic module has a rack with a printed circuit board (15a) with a protection cover (42). There is a thermal connection between the upper component face with a high thermal conductivity mechanism (50). There is a surface (S1) adjoining the component (S2) with a thermal conductivity above that of the cover.