SURFACE MOUNT LIGHT EMITTING DIODE

摘要

PROBLEM TO BE SOLVED: To secure an LED chip on the inner end of a lead frame so as not to move the inner end even by thermally expanding when soldering the frame by allowing a coating member covering the chip to reflow in the containing part of the casing. SOLUTION: The partition wall 17 of a casing 10 has a partition wall 17a and a holding part 17b. The part 17b is formed to become a T shape in cross section together with the wall 17a at the upper end of the wall 17a. The part 17b sandwiches the end of the inner end 21 of the lead frame 20 between the one side end of the width direction and the bottom 12b of the containing part 12 of the casing 10, and sandwiches the end of the inner end 31 of the lead frame 30 between the other side of the width direction and the bottom 12b of the part 12.