| 摘要 |
PROBLEM TO BE SOLVED: To eliminate a preforming process of solder, when die-bonding a semiconductor chip to a lead frame and to die-bond a chip, having a size almost equal to the die pad size of the lead frame. SOLUTION: A semiconductor wafer 11 has a plurality of semiconductor devices 12 and a metal portion on the bottom surface. In the metal portion, solder layers 13 are bonded individually to the respective semiconductor devices 12. By dicing the semiconductor wafer, having semiconductor devices 12 in the unit of semiconductor device made on the semiconductor wafer 11, semiconductor chips are formed each of which has a solder layer with the same size or smaller than the semiconductor device at the metal portion on the bottom surface of the semiconductor device. |
