发明名称 CIRCUIT BOARD PROVIDED WITH BUILT-IN CAPACITOR AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a circuit board which is reduced in its inductance component and can be provided with a built-in capacitor using a high permittivity dielectric layer such as a perovskite structure oxide layer, and to provide a semiconductor device which uses the capacitor as a decoupling capacitor and is reduced switching noise and an unnecessary electromagnetic radiation. SOLUTION: A conductive member is used as a base substrate of a circuit board, a capacitor to use the base substrate as the electrode on one side of electrodes of the capacitor is formed on the surface of the base substrate, at least two groups of connection terminal pairs consisting of adjacent two connection terminals connected with the two electrodes constituting the capacitor are provided, and the connection terminal pairs are arranged so that component in the directions opposite to each other are increased in currents which are made to flow to the two electrodes of the capacitor. At least, one group of the connection terminal pairs connected with the same capacitor is connected with a power line and a ground line of a semiconductor chip, and at least the other group of the connection terminal pairs is connected with a power line and a ground line of a wiring board.</p>
申请公布号 JP2001177008(A) 申请公布日期 2001.06.29
申请号 JP19990362212 申请日期 1999.12.21
申请人 HITACHI LTD 发明人 MATSUZAKI EIJI;ISHIHARA SHOSAKU;ABE YOICHI;MATSUSHIMA NAOKI;SHIGI HIDETAKA
分类号 H01G4/33;H01L23/12;H05K3/46;(IPC1-7):H01L23/12 主分类号 H01G4/33
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