SEMICONDUCTOR DEVICE, BONDING METHOD, ELECTRONIC EQUIPMENT AND BONDING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a bonding material which can suitably bond semiconductor devices in a multi-chip package, a bonding method of semiconductor devices, a semiconductor device and electronic equipment. SOLUTION: In a bonding material 20, micro-capsules 30, 32 of sealing material are arranged in paste-like thermosetting resin 22 comprising conductive particles 24. A first reaction heat generating material 26 and a second reaction heat generating material 28 are enclosed in microcapsules 30, 32 respectively. The thermosetting resin 22 which shows adhesion on setting by heating, and the conductive particles 24 which ensures electrical conduction on coming into contact with an electrode, are provided.