| 摘要 |
PROBLEM TO BE SOLVED: To enhance productivity by reducing the irradiation treatment time of electromagnetic waves, such as laser. SOLUTION: A catalyst for plating and its compound are deposited onto the surface of an insulating base material 1 for forming a plated foundation layer 2. Electromagnetic waves, such as those of laser, are applied to the boundary region between a circuit part 3 of the insulating base material and a non- circuit part 4 corresponding to the pattern of the non-circuit part 4, thus dispensing with the plated foundation layer 2 of an irradiation part where the electromagnetic waves such as laser are applied, while the non-irradiation part remains. After that, plating is made to the plated foundation layer 2. The irradiation of the laser or the like is made to the boundary region of the circuit part 3 in the non-circuit part 4, and there is not need to apply laser to the entire surface of the wide region of the non-circuit part 4.
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