| 摘要 |
PROBLEM TO BE SOLVED: To reliably connect end face through holes formed in the end faces of a module substrate with a mother board even if a warpage is developed in the substrate or the like. SOLUTION: Recessed curve-shaped end face trough holes 13 are formed in the end faces of a substrate 11, and the holes 13 are respectively constituted of each almost half-elliptic hole-shaped end face opening groove 14 provided in the outer peripheral edge of the substrate 11, and each electrode 15 which is provided in the depth part of this groove 14 and is formed into an almost semi-circular arc shape. A solder 17 is filled in the grooves 14. As a result, when the solder 17 is heated, the solder 17 is drooped on the backside of the substrate and the holes 13 are connected with electrode pads on a mother board.
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