| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermocompression bonding apparatus which suppresses the occurrence of wrinkles in a flexible film and can suppress the deformation of the flexible film as much as possible, without the occurrence of a part which is not closely stuck between a semiconductor chip and the flexible film at the time of thermocompression-bonding plural semiconductor chips to the flexible film. SOLUTION: In a thermal bonding apparatus 100, bonded articles 1 and 20 are bonded to the flexible film 2 having a thermal bonding resin layer through the thermal bonding resin layer. The device has a stage 9 where the bonded articles are placed, a pressurizing head 4 pressurizing the flexible film 2 onto the bonded articles placed on the stage 9 from above, and particulates 8 arranged between the pressurizing head 4 and the flexible film 2. The flexible film 2 has a wiring pattern and the bonded articles are set to be plural semiconductor chips 1 which are previously connected to the wiring pattern.
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