DUMMY WAFER AND METHOD OF HEAT-TREATING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a dummy wafer which is mounted on a wafer boat in a semiconductor device manufacturing process and can secure sufficient mechanical strength for the suppression of deformation and a superior breakage resistance. SOLUTION: This dummy wafer has a reinforcing section 14 formed on at least one surface of its main body, having the same shape as that of a semiconductor wafer which is expected to be commercialized. The reinforcing section 14 comprises an annular circumference reinforcing section 18, which reinforces the circumferential section of the body and a radial section 16 which extends radially from the center of the body.