| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermocompression bonding device for an anisotropic conducting film connection wherein the misalignment of upper and lower circuits is not caused, without doing compensation by design even in case of the narrow pitch or the long connection length. SOLUTION: In the thermocompression bonding device to connect electric and electronic circuit using an anisotropic conducting film, this device installs an upper part tool heated at the necessary temperature in the upper part of the thermopressure- contacting device, a lower part tool heated with the necessary temperature in the lower part of the device opposed to face the upper part tool is arranged, and a stage is installed which retains a circuit board to which the upper and lower circuit has been temporarily connected at the place between these two tools via the anisotropic conducting film, and the lower tool is fixed, and the upper tool and the stage descend at a different speed, and by the fact that nearly at the same time as the bottom face of the circuit board contacts with the top face of the lower tool, the bottom face of the upper tool contacts with the top face of the circuit, and the heat and pressure are made to be applied from the top and bottom faces of the circuit board.
|
