| 摘要 |
PROBLEM TO BE SOLVED: To eliminate a performing process of solder S and to die-bond a chip having a size almost equal to the die pad size of the lead frame. SOLUTION: A semiconductor wafer 11 has a plurality of semiconductor device 12 and a metal portion 11a on the bottom surface. By dicing the semiconductor wafer, having semiconductor devices 12 in units of the semiconductor device made on the semiconductor wafer 11, semiconductor chip are formed each of which has a solder layer with almost the same size as that of the semiconductor device at the metal portion on the bottom surface of the semiconductor device. A semiconductor chip, having a size larger than conventionally is mounted on and die-bonded to the die pad of the lead frame by the use of this semiconductor chip. |
