| 摘要 |
PROBLEM TO BE SOLVED: To provide a BGA type semiconductor device which has strong resistivity to a heat cycle test without softening a signal layer, and restricts a popcorn phenomenon, and a both-face wiring type TAB tape used therefore. SOLUTION: As a base material 16 of a both-face wiring type TAB tape 1, copper foils 203, 204 are adhered to both faces of an insulation tape 202 with adhesives 15 at thickness 3 to 25μm, and a composite material in which a water absorption rate of the insulation tape 202 is set to 2.8% or less is used. |
